QSFP+ solution is designed for high-density applications

Siemon Interconnect Solutions QSFP+ (Quad Small Form-factor Pluggable Plus) Copper Cable assemblies were developed for high-density applications, offering a cost-effective, low-power option for high-speed data center interconnects up to 10 meters. The QSFP+ form factor (Quad SFP+) can replace up to four standard SFP+ connections, providing greater density and reduced system cost. The direct-attach assemblies support emerging 40Gb/s applications and are available in standard lengths up to 6 meters with longer custom lengths available.Quad Small Form-factor Pluggable QSFP to CX4 DDR Cable 2M, Passive solution is designed for high-density applications. Components of the system include the Electro Magnetic Interference (EMI) shielding cage, active optical cables (AOC), passive copper cable assembly, active copper cable assembly, optical MTP cable assembly, optical loopback, 38-circuit SMT iPass? host connector, and stacked integrated connectors and cages.